Multichip Module Technologies:Materials for Multi-Layered AlN Packages

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Materials for Multi-Layered AlN Packages

Aluminum nitride is a synthetic compound manufactured by two processes: the carbothermal reduction of alumina (Eq. 9.2) and/or direct nitridation of aluminum metal (Eq. 9.3):

Multichip Module Technologies-0132

MCM-D

Modules are formed by the deposition of thin-film metals and dielectrics, which may be polymers or inorganic dielectrics. These are commonly called thin-film MCMs.

Here, the focus will be on materials to fabricate the high-density MCM-D interconnect. The materials of construction can be categorized as the thin-film dielectric, the substrate, and the conductor metallization.

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