Microelectronics Packaging

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Introduction

An “electronic package” can be defined as the portion of an electronic structure which serves to protect an electronic device from its environments and the environment from the electronic device. Packaging is an art based on the science of establishing interconnections and a suitable operating environment for predominantly electrical circuits. It supplies the chips with wires to distribute signals and power, remove the heat generated by the circuits, and provides them with physical support and environmental protection [1,2]. With continued demand for better performance, the electronics industry has been forcing more and more circuitry onto a silicon chip. As the circuit density increases, the number of electrical connections on a chip increases, and the time it takes for an electrical signal to travel form one chip to another as well as the retention of signal integrity have become important considerations. Besides, power requirements of the chip have increased dramatically and dissipating the heat to keep the chip running at its design temperature is an important requirement. Packaging is rapidly becoming an area of microelec- tronics technology that can limit the operating speed on an integrated circuit. The evolution of packaging is a response to the need to optimize for cost, performance, and reliability, with the emphasis shifting according to application priorities (see Figure 8.1 and Table 8.1).

High gate count, high speed, low voltage, low noise

(Communication systems, multimedia systems, high-speed computing systems, etc.)

Microelectronics Packaging-0113

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